Bga Solder Ball Size For Micro Welding Mobile Phone Repair Tools Soldering Ball Diameter 0.25mm

Item No. 557-HAG2-BST-505-025

Bga Solder Ball Size For Micro Welding Mobile Phone Repair Tools Soldering Ball Diameter 0.25mm Dimensions:35mm*16mm Certification:CE ROHS After-sales Service Provided:No overseas service provided Function:Repair Mobile Warranty:1 Year Color:Silver Grey

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Description

Bga Solder Ball Size For Micro Welding Mobile Phone Repair Tools Soldering Ball Diameter 0.25mm
Dimensions:35mm*16mm Certification:CE ROHS After-sales Service Provided:No overseas service provided Function:Repair Mobile Warranty:1 Year Color:Silver Grey

Specifications

Brand / Manufacturer	Generic / OEM
Condition	New product
Garantietermijn	1 Year Carry-In
Description	"Bga Solder Ball Size For Micro Welding Mobile Phone Repair Tools Soldering Ball Diameter 0.25mm Dimensions:35mm*16mm Certification:CE ROHS After-sales Service Provided:No overseas service provided Function:Repair Mobile Warranty:1 Year Color:Silver Grey"