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Bga Solder Ball Size For Micro Welding Mobile Phone Repair Tools Soldering Ball Diameter 0.4mm
Art nr.
557-HAG2-BST-505-040
Bga Solder Ball Size For Micro Welding Mobile Phone Repair Tools Soldering Ball Diameter 0.4mm Dimensions:35mm*16mm Certification:CE ROHS After-sales Service Provided:No overseas service provided Function:Repair Mobile Warranty:1 Year Color:Silver Grey
Omschrijving
Bga Solder Ball Size For Micro Welding Mobile Phone Repair Tools Soldering Ball Diameter 0.4mm
Dimensions:35mm*16mm Certification:CE ROHS After-sales Service Provided:No overseas service provided Function:Repair Mobile Warranty:1 Year Color:Silver Grey
Dimensions:35mm*16mm Certification:CE ROHS After-sales Service Provided:No overseas service provided Function:Repair Mobile Warranty:1 Year Color:Silver Grey
Specificaties
| Artikel conditie | Nieuw |
| Garantietermijn | 12 maanden carry-in |
| Uitgebreide omschrijving | "Bga Solder Ball Size For Micro Welding Mobile Phone Repair Tools Soldering Ball Diameter 0.4mm Dimensions:35mm*16mm Certification:CE ROHS After-sales Service Provided:No overseas service provided Function:Repair Mobile Warranty:1 Year Color:Silver Grey" |
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